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𝐀𝐈 𝐄𝐧𝐠𝐢𝐧𝐞𝐞𝐫𝐢𝐧𝐠 & 𝐈𝐧𝐧𝐨𝐯𝐚𝐭𝐢𝐨𝐧 𝐒𝐮𝐦𝐦𝐢𝐭 𝟐𝟎𝟐𝟒 𝐢𝐬 𝐂𝐨𝐦𝐢𝐧𝐠 𝐭𝐡𝐢𝐬 𝐃𝐞𝐜𝐞𝐦𝐛𝐞𝐫!
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Beyond Green: AI for a Thriving Future Pitch Competition invites participants to explore how AI can foster a thriving future by regenerating the planet, building a sustainable economy, an promoting societal well-being
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The Summer of Protocols (SoP) program, funded by the Ethereum Foundation, in collaboration with CMKL University, Seapunk Studios, and Global Chinese Community, is excited to present Khlongs and Subaks.
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On 12 Dec 2025, the AI Engineering Institute (AIEI) and CMKL University successfully convened the AI Innovation Summit 2025 at Club Siam Glowfish, Bangkok, under the theme “Enabling Endless Possibilities with AI.”


The AI Engineering Institute (AIEI) and CMKL University are bringing together policymakers, industry leaders, researchers, startups, and young innovators at Club Siam Glowfish, Bangkok (11th Floor Siam Patumwan House) for a full day dedicated to Thailand’s AI transformation.


CMKL University proudly received the HGX H200 PoC—marking the arrival of Asia's first NVIDIA H200.


The 13th edition of IEEE cloud computing technology and science (CloudCom) Conference, sponsored by IEEE Computer Society and its Technical Committee on Cloud Computing (TCCLD), PMU-C, NVIDIA, AWS, T.C.C. Technology, and Yip In Tsoi, at the Millennium Hilton Bangkok on December 13–16, 2022 has finally ended on a high note, parting with new innovations, ideas, friendships, and much more! Due to the global COVID-19 epidemic, the conference has been pushed back due to travel regulations and organizational restrictions.

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AiCE PathSense Team Wins AIS Jump Hackathon 2025


CMKL x KMITL แถลงข่าวใช้ AI คัดกรอง Covid สายพันธุ์มิวได้สำเร็จในวันที่ 27 กันยายนที่ผ่านมา ณ มหาวิทยาลัยซีเอ็มเคแอล ภายในงานได้มีการแสดงศักยภาพของ APEX Supercomputer ที่สามารถใช้ AI ตรวจหาเชื้อโควิดสายพันธุ์ใหม่ได้

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The AI Engineering Institute (AIEI), in collaboration with DELL Technologies, proudly announces the AI Engineering & Innovation Summit 2024, which took place on December 13, 2024.